代表性论文或成果：
1. Homologous temperature dependence of global surface scaling behaviors of polycrystalline copper films. Appl Phys Lett, 2009, 95(19): 194104(1-3) .
2. Ultrathin CuSiN/p-SiC:H bilayer capping barrier for Cu/ultralow-k dielectric integration. Appl Phys Lett, 2009, 94(15): 153116(1-3).
3. Characterization of multiscale surface evolution of polycrystalline copper thin films. J Appl Phys, 2007, 101(10): 104902(1-7).
4. Effect of substrate on surface morphology evolution of Cu thin films deposited by magnetron sputtering. Surf & Coat Tech, 2007, 201(9-11): 5574-5577.
5. Kinetic Surface Roughening of TaN Thin Films Sputtered at Different N2/Ar Flow Ratios. Proc IEEE, 2010, 823-924.  

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E-Mail: jjyang@scu.edu.cn